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IEC 61189-3:2007

Current

Current

The latest, up-to-date edition.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

09-10-2007

$864.27
Including GST where applicable
Summarise this standard

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Accuracy, precision and resolution
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
9 M: Mechanical test methods
10 E: Electrical test methods
11 N: Environmental test methods
12 X: Miscellaneous test methods
Annex A (informative) Worked examples

IEC 61189-3:2007 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major technical changes with regard to the previous edition concern the addition of 25 new tests, as follows:
- 6 V: Visual test methods: 3V01, 3V02 and 3V03;
- 7 D: Dimensional test methods: 3D03;
- 8 C: Chemical test methods: 3C02, 3C13 and 3C14;
- 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09;
- 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18;
- 11 N: Environmental test methods: 3N03, 3N07 and 3N12;
- 12 X: Miscellaneous test methods: 3X01.

Committee
TC 91
DevelopmentNote
To be used in conjunction with IEC 61189-1, IEC 61189-2, IEC 61189-5, IEC 61189-6 and IEC 60068 (all parts). (10/2007) A Bilingual edition has been published. (09/2012) Stability Date: 2020. (09/2017)
DocumentType
Standard
Pages
118
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

$864.27
Including GST where applicable