IEC 61967-4:2002+AMD1:2006 CSV
Superseded
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Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
27-07-2006
31-12-2021
FOREWORD
1 Scope
2 Normative references
3 Definitions
4 General
4.1 Measurement basics
4.2 RF current measurement
4.3 RF voltage measurement at IC pins
4.4 Assessment of the measurement technique
5 Test conditions
6 Test equipment
6.1 Test receiver specification
6.2 RF current probe specification
6.3 Test of the RF current probe capability
6.4 Matching network specification
7 Test set-up
7.1 General test configuration
7.2 Printed circuit test board layout
8 Test procedure
9 Test report
Annex A (normative) Probe calibration procedure
Annex B (informative) Classification of conducted emission
levels
B.1 Introductory remark
B.2 General
B.3 Definition of emission levels
B.4 Presentation of results
Annex C (informative) Example of reference levels for
automotive applications
C.1 Introductory remark
C.2 General
C.3 Reference levels
Annex D (informative) EMC requirements and how to use EMC IC
measurement techniques
D.1 Introduction
D.2 Using EMC measurement procedures
D.3 Assessment of the IC influence to the EMC behaviour
of the modules
Annex E (informative) Example of a test set-up consisting of
an EMC main test board and an EME IC
test board
E.1 The EMC main test board
E.2 EME IC test board
Annex F (informative) 150 ohm direct coupling networks for
common mode emission measurements of
differential mode data transfer ICs
and similar circuits
F.1 Basic direct coupling network
F.2 Example of a common-mode coupling network alternative
for high speed CAN or LVDS or RS485 or similar systems
F.3 Example of a common-mode coupling network alternative
for differential IC outputs to resistive loads (e.g.
airbag ignition driver)
F.4 Example of a common-mode coupling network for fault
tolerant CAN systems
Figures
Tables
Specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods guarantee a high degree of repeatability and correlation of EME measurements. IEC 61967-1 specifies general conditions and definitions of the test methods. The contents of the corrigendum 1 of June 2017 have been included in this copy.
This consolidated version consists of the first edition (2002) and its amendment 1 (2006). Therefore, no need to order amendment in addition to this publication.
| Committee |
TC 47/SC 47A
|
| DevelopmentNote |
Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
65
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| DIN EN 61967-4:2006-07 | Identical |
| NEN EN IEC 61967-4 : 2002 C1 2017 | Identical |
| I.S. EN 61967-4:2002 | Identical |
| PN EN 61967-4 : 2003 AC 2007 | Identical |
| BS EN 61967-4 : 2002 | Identical |
| EN 61967-4 : 2002 COR 2017 | Identical |
| NF EN 61967-4 : 2002 AMD 1 2006 | Identical |
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