IEC 62415:2010
Current
The latest, up-to-date edition.
Semiconductor devices - Constant current electromigration test
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
19-05-2010
FOREWORD
1 Scope
2 Symbols, terms and definitions
3 Background
4 Sample size
5 Test structures
6 Test conditions
7 Failure criteria
8 Data analysis
Bibliography
IEC 62415:2010 describes a method for conventional constant current electromigration testing of metal lines, via string and contacts.
| Committee |
TC 47
|
| DevelopmentNote |
Stability Date: 2020. (12/2017)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NBN EN 62415 : 2010 | Identical |
| NEN EN IEC 62415 : 2010 | Identical |
| I.S. EN 62415:2010 | Identical |
| PN EN 62415 : 2010 | Identical |
| BS EN 62415:2010 | Identical |
| CEI EN 62415 : 2011 | Identical |
| EN 62415:2010 | Identical |
| DIN EN 62415:2010-12 | Identical |
| UNE-EN 62415:2010 | Identical |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
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