IEC 62769-6:2023 RLV
Current
The latest, up-to-date edition.
Field Device Integration (FDI®) - Part 6: FDI Technology Mappings
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
06-04-2023
IEC 62769-6:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.
| Committee |
TC 65/SC 65E
|
| DocumentType |
Redline
|
| Pages |
42
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
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