IEC 62769-8:2023
Current
The latest, up-to-date edition.
Field device integration (FDI®) - Part 8:EDD to OPC-UA Mapping
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
05-04-2023
IEC 62769-8:2023 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.
| Committee |
TC 65/SC 65E
|
| DocumentType |
Standard
|
| Pages |
105
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| DS/EN IEC 62769-8:2023 | Identical |
| BS EN IEC 62769-8:2023 | Equivalent |
| I.S. EN IEC 62769-8:2023 | Equivalent |
| CEI EN IEC 62769-8:2023 | Identical |
| UNE-EN IEC 62769-8:2023 | Identical |
| CEI EN IEC 62769-109-1:2023 | Field Device Integration (FDI®) Profiles - HART® and Wireless HART® |
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