IEC 62878-2-603:2025
Current
The latest, up-to-date edition.
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
25-02-2025
IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).
| DocumentType |
Standard
|
| Pages |
25
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| I.S. EN IEC 62878-2-603:2025 | Equivalent |
| BS EN IEC 62878-2-603:2025 | Equivalent |
| CEI EN IEC 62878-2-603:2025-05 | Identical |
| DS/EN IEC 62878-2-603:2025 | Identical |
| UNE-EN IEC 62878-2-603:2025 | Identical |
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