IPC 4203B : 2018
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Cover and Bonding Material for Flexible Printed Circuitry
English
01-03-2018
29-04-2026
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, and supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry.
| DocumentType |
Standard
|
| ISBN |
978-1-61193-354-3
|
| Pages |
52
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |