IPC-7530:2025
Current
The latest, up-to-date edition.
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
English, Japanese
31-01-2025
This document describes thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow and wave soldering.
| DocumentType |
Standard
|
| ISBN |
978-1-63816-203-2
|
| Pages |
52
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| Supersedes |
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