IPC 9707:2011/AMD 1:2018
Current
The latest, up-to-date edition.
Spherical Bend Test Method for Characterization of Board Level Interconnects
English
01-05-2018
This standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly, manufacturing, and test operations.
| DocumentType |
Amendment
|
| Pages |
7
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
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