IPC MC 324 : 1988
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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PERFORMANCE SPECIFICATIONS FOR METAL CORE BOARDS
English
23-11-2012
23-07-2013
NO CONTENTS SECTION
Establishes the qualification and performance requirements for a metal core packaging interconnection (P/I) structure, hereafter referred to as a metal core board. Metal core boards consist of at least one conductive pattern on each side of an insulated metal substrate. Interconnection between conductive patterns shall be made using plated-through holes. The metal substrate shall be an integral part of the metal core board prior to interconnecting the conductive pattern. The following specific topics are covered: product classifications; metal core board types; metal core insulating methods.
| DocumentType |
Standard
|
| Pages |
56
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| A-A-113 Revision D:1996 | Tape, Pressure-Sensitive Adhesive |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| IPC D 300 : G1984 | PRINTED BOARD DIMENSIONS AND TOLERANCES |
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| QQ-C-576 Revision B:1961 | Copper Flat Products with Slit and Edge-Rolled, Sheared, Sawed or Machined Edges, (Plate, Bar, Sheet, and Strip) (S/S by ASTM-B152) |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| QQ-A-250-11 Revision F:1982 | Aluminum Alloy 6061, Plate and Sheet (See Notice 3 for Replacement Information) |
| IPC L 125 : A | Specification for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections |
| IPC L 108 : B | SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS |
| IPC L 115 : B | SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC L 112 : A92 | SPECIFICATION FOR COMPOSITE METAL CLAD BASE MATERIALS FOR PRINTED BOARDS |
| MIL-T-10727 Revision C:1989 | TIN PLATING: ELECTRODEPOSITED OR HOT-DIPPED, FOR FERROUS AND NONFERROUS METALS (S/S BY ASTM-B545, ASTM-B339) |
| MIL-I-45208 Revision A:1963 | Inspection System Requirements (No S/S Document) |
| IPC FC 232 : C1994 AMD 1 1995 | ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS |
| IPC FC 231 : C1992 AMD 1 1995 | FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING |
| IPC SF 818 : 1991 | GENERAL REQUIREMENTS FOR ELECTRONIC SOLDERING FLUXES |
| IPC S 804 : A1987 | PRINTED WIRING BOARDS, SOLDERABILITY TEST METHODS FOR, |
| MIL G 45204 : C | GOLD PLATING, ELECTRODEPOSITED |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEG. C) (S/S BY J-STD-004, J-STD-005 AND J-STD-006) |
| MIL-C-14550 Revision B:1983 | Copper Plating (Electrodeposited) (S/S by SAE-AMS2418) |
| MIL-P-81728 Revision A:1973 | PLATING, TIN LEAD (ELECTRODEPOSITED (S/S BY SAE-AMS-P-81728) |
| IPC L 109 : B | SPECIFICATION FOR RESIN PREIMPREGNATED FABRIC (PREPREG) FOR MULTILAYER PRINTED BOARDS |
| IPC CF 150 : E | COPPER FOIL FOR PRINTED WIRING APPLICATIONS |
| MIL-STD-202 Revision H:2015 | Electronic and Electrical Component Parts |
| IPC FC 241 : C1992 AMD 1 1995 | FLEXIBLE METAL CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED WIRING |
| IPC CF 152 : B | COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS |
| QQ-N-290 Revision A:1971 | NICKEL PLATING (ELECTRODEPOSITED) (S/S BY SAE-AMS-QQ-N-290) |
| QQ-S-635 Revision B:1976 | Steel Plate, Carbon (S/S by ASTM-A827) |