ISO/TS 10303-1688:2010
Current
The latest, up-to-date edition.
Industrial automation systems and integration — Product data representation and exchange — Part 1688: Application module: Interconnect non planar shape
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English
18-05-2010
ISO/TS 10303-1688:2010-03 specifies the application module for Interconnect non planar shape.
The following are within the scope of ISO/TS 10303-1688:2010-03:
- three dimensional manifold surface representation of an interconnect substrate;
- placement of footprint and other planar feature definitions in a three dimensional manifold surface representation including changing the planar shape to a manifold shape.
| Committee |
ISO/TC 184/SC 4
|
| DocumentType |
Technical Specification
|
| Pages |
8
|
| PublisherName |
International Organization for Standardization
|
| Status |
Current
|
| Supersedes |
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