JEDECJESD22-B113B : 2018
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS
Hardcopy , PDF
English
01-08-2018
24-12-2025
The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of SMT ICs in an accelerated test environment for handheld electronic products applications. The purpose is to standardize the test methodology to provide a reproducible performance assessment of SMT ICs while duplicating the failure modes normally observed during product level test.
| DocumentType |
Test Method
|
| Pages |
26
|
| ProductNote |
this Standards also refers IPC-SMT-782 , J-STD-020, J-STD-033,IPC-9701, IPC/JEDEC-9702, IPC/JEDEC-9704,IPC/JEDEC-9706 .
JESD22-B113A and JESD22-B113 . |
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.