Test methods for lead-free solders Part 6: Methods for 45°pull test of solder joints on QFP lead

Available format(s)

Hardcopy , PDF

Language(s)

English, Japanese

Published date

20-06-2003

Publisher

Japanese Standards Association

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This Standard specifies methods for 45 deg. pull test of solder joints on QFP lead to be used principally for wiring connection, components connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.

DocumentType	Test Method
Pages	7
PublisherName	Japanese Standards Association
Status	Current

Reaffirmed 2013 2003(R2013) [21/10/2013]2003(R2008) [01/10/2008]2003 [20/06/2003]

JIS Z 3197:1999	Testing methods for soldering fluxes
JIS Z 3284:1994	Solder paste
JIS Z 3283:2006	Resin flux cored solders

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JIS Z 3198-6:2003

Test methods for lead-free solders Part 6: Methods for 45°pull test of solder joints on QFP lead

Table of Contents

Abstract

General Product Information

History

Standards Referenced By This Book

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