NEN EN IEC 60191-6-19 : 2010
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF THE PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE
Published date
12-01-2013
Publisher
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Defines measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).
| DevelopmentNote |
Supersedes NEN NPR IEC/PAS 60191-6-19. (09/2010)
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| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 60191-6-19:2010 | Identical |
| IEC 60191-6-19:2010 | Identical |
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