NEN EN IEC 60749-23 : 2004 AMD 1 2011
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE
12-01-2013
Determines the effects of bias conditions and temperature on solid-state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.
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