NEN EN IEC 62137-4 : 2015 C11 2015
Current
Current
The latest, up-to-date edition.
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
Published date
20-04-2015
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Defines the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress.
| DevelopmentNote |
Supersedes NEN EN IEC 62137. (04/2015)
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| DocumentType |
Standard
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| PublisherName |
Netherlands Standards
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| Status |
Current
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| Supersedes |
| Standards | Relationship |
| IEC 62137-4:2014 | Identical |
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