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NEN EN IEC 62374-1 : 2010 C11 2011

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - PART 1: TIME-DEPENDENT DIELECTRIC BREAKDOWN (TDDB) TEST FOR INTER-METAL LAYERS

Published date

12-01-2013

Explains a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

DocumentType
Standard
PublisherName
Netherlands Standards
Status
Current

Standards Relationship
EN 62374-1:2010/AC:2011 Identical
IEC 62374-1:2010 Identical

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