NF EN 60191-6 : 2011

1 Scope
2 Normative references
3 Definitions
4 Design rules
5 Dimensions to be specified
6 Notes
Annex A (informative) Illustration of the rules
  A.1 Gull-wing lead package with two parallel rows of
      terminals (SOP,TSOP Type 2)
  A.2 Gull-wing lead package with two parallel rows of
      terminals (TSOP Type 1)
  A.3 Gull-wing lead package with one row of terminals
      on each of four sides (QFP)
  A.4 J-bent lead package with two parallel rows of
      terminals (SOJ)
  A.5 Folded lead package with one row of terminals on
      each of four sides (QFJ)
  A.6 Leadless package
      A.7-1 Ball grid array package (BGA) Type 1
      A.7-2 Ball grid array package (BGA) Type 2
Annex B (informative) Optional table format
Annex ZA (normative) Normative references to international
                       publications with their corresponding
                       European publications
Figures

Provides rules for the preparation of outlines drawings of surface-mounted semiconductor devices.