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PD IEC/TR 62258-7:2007

Current

Current

The latest, up-to-date edition.

Semiconductor die products XML schema for data exchange

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-11-2007

INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 General
5 Data exchange
Annex A (normative) - XML schema
Annex B (informative) - XML example
Bibliography

Assists the production, supply and use of semiconductor die products, including: - wafers; - singulated bare die; - die and wafers with attached connection structures; - minimally or partially encapsulated die and wafers.

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.

Committee
EPL/47
DevelopmentNote
Supersedes 06/30146849 DC. (12/2007)
DocumentType
Standard
Pages
28
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
IEC TR 62258-7:2007 Identical

IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
IEC 62258-5:2006 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
IEC 62258-6:2006 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers

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