PN EN 62047-13 : 2012
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR- TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES
Published date
12-01-2013
Publisher
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Describes the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens.
| Committee |
TC 60
|
| DocumentType |
Standard
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62047-13:2012 | Identical |
| EN 62047-13:2012 | Identical |
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