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PN EN 62374-1 : 2011 AC 2011

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - PART 1: TIME-DEPENDENT DIELECTRIC BREAKDOWN (TDDB) TEST FOR INTER-METAL LAYERS

Published date

12-01-2013

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Specifies a test method, test structure and lifetime estimation method of Time Dependent Dielectric Breakdown (TDDB) for Inter-metal layers applied in semiconductor devices.

Committee
TC 60
DevelopmentNote
Supersedes PN EN 62374. (01/2012)
DocumentType
Standard
PublisherName
Polish Committee for Standardization
Status
Current
Supersedes

Standards Relationship
EN 62374-1:2010/AC:2011 Identical

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