09/30184127 DC : 0

1 Scope
2 Normative references
3 Definitions
4 Symbols
5 Context and conditions
  5.1 Failure modes
  5.2 Operating profile considerations
  5.3 Storage conditions
  5.4 Environmental conditions
6 Generic reference conditions and stress models
  6.1 Recommended generic reference conditions
  6.2 Generic stress models
7 Specific reference conditions and stress models
  7.1 Integrated semiconductor circuits
  7.2 Discrete semiconductors
  7.3 Optoelectronic components
  7.4 Capacitors
  7.5 Resistors and resistor networks
  7.6 Inductors, transformers and coils
  7.7 Microwave devices
  7.8 Other passive components
  7.9 Electrical connections
  7.10 Connectors and sockets
  7.11 Relays
  7.12 Switches and push-buttons
  7.13 Signal and pilot lamps
Annex A (Normative) - Failure modes of components
Annex B (Informative) - Failure rate prediction
  B.1 Failure Rate Prediction for Assemblies
  B.2 Component considerations
  B.3 General consideration about failure rate
Annex C (informative) - Considerations for the design
        of a data base on failure rates
  C.1 General
  C.2 Data collection acquisition - collection process
  C.3 Which data to collect and how to collect it
  C.4 Calculation and decision making
  C.5 Failure rate database attributes
Annex D (informative) - Potential sources of failure rate data
        and methods of selection
  D.1 General
  D.2 Data source selection
  D.3 User data
  D.4 Manufacturer data
  D.5 Handbook reliability data
Annex E (informative) - Overview of component classification
  E.1 General
  E.2 The IEC 61360 system
  E.3 Other systems
Annex F (informative) - Examples

BS EN 61709