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1 Scope
2 Test apparatus
  2.1 Solder bath
  2.2 Dipping device
  2.3 Optical equipment
  2.4 Steam ageing equipment
  2.5 Lighting equipment
  2.6 Materials
      2.6.1 Flux
      2.6.2 Solder
  2.7 SMD reflow equipment
      2.7.1 Stencil or screen
      2.7.2 Rubber squeegee or metal spatula
      2.7.3 Test substrate
      2.7.4 Solder paste
      2.7.5 Reflow equipment
      2.7.6 Flux removal solvent
3 Procedure
  3.1 Lead-free backward compatibility
  3.2 Preconditioning
      3.2.1 Preconditioning by steam ageing
      3.2.2 Preconditioning by high temperature storage
  3.3 Procedure for dip and look solderability testing
      3.3.1 Solder dip conditions
      3.3.2 Procedure
  3.4 Procedure for simulated board mounting reflow
      solderability testing of SMDs
      3.4.1 Test equipment set-up
      3.4.2 Specimen preparation and surface condition
      3.4.3 Visual inspection
4 Summary
Bibliography

BS EN 60749-21