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Superseded
View Superseded by
BS EN 62047-13 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR- TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES
Hardcopy , PDF
English
05-31-2012
1 Scope
2 Normative references
3 Symbols and designations
4 Testing method
5 Test pieces
6 Test report
Annex A (Informative) - Technical background
BS EN 62047-13
| Committee |
EPL/47
|
| DocumentType |
Draft
|
| Pages |
13
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
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