10/30215537 DC : 0
Superseded
Superseded
View Superseded by
BS EN 60191-6-12 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH LAND GRID ARRAY (FLGA) - RECTANGULAR TYPE
Available format(s)
Hardcopy , PDF
Language(s)
English
Publisher
Superseded date
08-31-2011
Superseded by
US$29.42
Excluding Tax where applicable
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Outline drawings and principle dimensions
7 Dimensions
BS EN 60191-6-12
| Committee |
EPL/47
|
| DocumentType |
Draft
|
| Pages |
20
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
Summarise
US$29.42
Excluding Tax where applicable