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Superseded
View Superseded by
BS EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BENDING TEST METHODS OF THIN FILM MATERIALS
Hardcopy , PDF
English
10-31-2013
FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test Piece
5 Testing method
6 Test report
Annex A (Informative) - Precautions necessary for the
specimen/substrate interface
BS EN 62047-18
| Committee |
EPL/47
|
| DocumentType |
Draft
|
| Pages |
13
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| IEC 62047-6:2009 | Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials |
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