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BS EN 62047-16 ED 1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS; WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS
Hardcopy , PDF
English
07-31-2015
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Testing methods
Bibliography
BS EN 62047-16 ED 1.0.
| Committee |
EPL/47
|
| DocumentType |
Draft
|
| Pages |
13
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| IEC 62047-21:2014 | Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials |
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