IPC HDBK 850 : 0
Current
The latest, up-to-date edition.
GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY
07-31-2012
1 SCOPE
2 APPLICABLE DOCUMENTS
3 P/E MATERIALS
4 ELECTRICAL CONSIDERATIONS
5 REWORK AND REPAIR
6 END USE ENVIRONMENT
7 LONG TERM RELIABILITY AND TESTING
8 EQUIPMENT CONSIDERATIONS
9 DESIGN CONSIDERATIONS IN P/E
10 ENCLOSURE CONSIDERATIONS
11 PREPARATION FOR P/E
12 DISPENSING
13 CURE MECHANISMS
14 APPLICATION PROCESS MONITORING
15 ENVIRONMENTAL, HEALTH AND SAFETY PROCESSING CONSIDERATIONS
16 INHIBITION
17 POTTING/COATING OVER ENCAPSULANTS
18 MATERIALS RELATED TO LEAD FREE PROCESSING THAT
AFFECT P/E
19 REWORK AND REPAIR PROCESSES
20 REGULATIONS
APPENDIX A - MSDS
APPENDIX B - Reference Documents
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