A-A-56022 Base Document:1994
Superseded
View Superseded by
Compound, Heat Sink, Silicone and/or Non-Silicone (S/S by MIL-C-47113)
English
05-20-1994
05-20-1994
| DocumentType |
Standard
|
| Pages |
4
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
This commercial item description covers a silicone and/or non-silicone and/or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal and improve thermal conductivity at heat sink junctions.
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