BS 3934-3:1992

Committees responsible
Foreword
Recommendations
1. Scope
2. Terminology and definitions
3. Cross-referencing of packages
4. Terminal identification - Numbering of terminals
5. Dimensions and reference letter symbols
6. Drawing layout
7. Dimensioning and tolerances
8. Inter-conversion of inch and millimetre dimensions
     and rules for rounding off
9. Definitions of families
10. Examples of drawings
11. Design procedure for dimensions of integrated
     circuit packages
12. Rules for mounting integrated circuit packages into
     carriers
13. Bending of terminals of QUIL packages (packages of
     a sub-family of Form 2)
14. Pin grid arrays
15. Rule for orientation of integrated circuit
     packages in handling and shipping carriers such as
     stick magazines and rails
Appendices
A. Limits applicable for the dimensions of integrated
    circuits package outlines
B. Example drawings showing cross-referencing of
    packages, utilization of reference letter symbols,
    terminal identification and index area
C. Terminal identification and numbering of terminals
    of devices with terminals disposed in three or more
    rows in each orthogonal direction
D. Design procedure for dimensions of integrated circuit
    packages of Form 2 Family
E. General rules for the preparation of outline drawings
    of packages of Form G intended for automated handling
F. General rules for the preparation of outline drawings
    of pin grid arrays
G. Rule for orientation of integrated circuit packages
    in handling and shipped carriers such as stick
    magazines and rails

Describes recommended practice for preparation of drawings of integrated circuit outlines. Includes sections on terminology and definitions, cross referencing of packages, terminal identification, dimensions and reference letter symbols, drawing layout, dimensioning and tolerances, and interconversion of inch and millimetre dimensions.