BS 3934-6:1992
Superseded
View Superseded by
Mechanical standardization of semiconductor devices Specification for the preparation of outline drawings of surface mounted semiconductor device packages
Hardcopy , PDF
English
04-01-1992
02-18-2005
Committees responsible
National foreword
Specification
1. Scope
2. Definitions
3. Design rules
Tables - Dimensions to be specified
Notes to the tables
4. Illustration of the rules
5. Recommended values
Figures
Appendices
A1. Drawing of leaded packages with two parallel rows of
terminals
A2. Drawing of leaded packages with one row of terminals
on each of the four sides
A3. Drawing of folded lead packages with one row of
terminals on each of the four sides
A4. Drawing of leadless packages
B1. Recommended values for leaded packages with two
parallel rows of terminals, original dimensions:
inches
Provides rules for preparation of outline drawings of surface-mounted semiconductor devices. Supplements IEC Publications and 191-1 & -3. Covers all surface-mounted devices - discrete semiconductors and integrated circuits - classified as form E in IEC Publication 191-4.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes BS 3934(1965). (10/2002) Supersedes BS 3934:ADD5(1983) (07/2004)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC 60191-6:1990 | Identical |
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