BS 4584-102.2(1990) : 1990 AMD 8242
Superseded
Superseded
View Superseded by
METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR PHENOLIC CELLULOSE PAPER COPPER CLAD LAMINATED SHEET, ECONOMIC QUALITY
Published date
11-23-2012
Publisher
Superseded date
08-15-1994
Superseded by
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Provides requirements for properties of phenolic cellulose paper copper clad laminated sheet, economic quality, in thicknesses of 0.5 mm up to 6.4 mm. Includes internal marking, packaging and marking.
| Committee |
ECL/19
|
| DevelopmentNote |
Renumbered and superseded by BS EN 60249-2.2 Supersedes BS 4584-4(1989). (05/2005)
|
| DocumentType |
Standard
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC 60249-2-2:1985 | Identical |
| BS 6221-22:1990 | Printed wiring boards Guide to the use of printed wiring board substrate materials: surface mount technology |
| IEC 60249-3A:1976 | First supplement: Metal-clad base materials for printed circuits - Specification No. 2: Specification for copper foil for use in the manufacture of copper clad base materials |
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