BS 4584-103.1:1990
Withdrawn
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
Hardcopy , PDF
English
02-28-1990
04-24-2012
National foreword
Committees responsible
Specification
1. Scope
2. Designations
3. Materials and construction
4. Bonding sheet material
5. Methods of test for bonding sheet material
Figure
1. Position of specimens for resin content, resin
flow, volatiles content and thickness
Two types of epoxide resin impregnated woven glass fabric with the resin cured to B stage.
| Committee |
EPL/501
|
| DevelopmentNote |
Also numbered as IEC 60249-3-1 Supersedes 89/23231 DC and BS 4584-11(1977) (08/2005)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| BS 7825-3.2:1997 | Calibration of rubber and plastics test equipment. Calibration schedules Electrical properties |
| BS 123700-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections |
| BS 123600-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections |
| BS 123300-003:2001 | System of quality assessment. Capability detail specification. Rigid multilayer printed boards |
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