BS 6221-20:1984
Withdrawn
Printed wiring boards Guide for the assembly of printed wiring boards
Hardcopy , PDF
English
04-30-1984
03-01-2006
Foreword
Committees responsible
Guide
1. Scope
2. Definitions
3. Handling of components prior to assembly
4. Stoving
5. Mounting of components
6. Board assembly
7. Solderability: process considerations
8. Soldering
9. Cleaning of boards and assemblies
10. Flatness
11. Inspection of printed board assemblies
12. Storage conditions
13. Terminals and connector jacks
14. Conformal coatings
15. Assembly of surface mounted devices
Tables
1. Devices sensitive to static discharge
2. Static resistance and acceptable discharge times
Figures
1. Simple offset preformed leads
2. Dimple preformed leads
3. Component sequencing
4. Single-sided assembly for SMDs only
5. Double-sided assembly for SMDs only
6. Mixed technologies with SMDs on only one side of PWB
7. Mixed technologies with SMDs on both sides of PWB
8. Condensation reflow
9. Conveyorized infra-red reflow furnace
10. Dual wave soldering
Recommends principles and practices for the assembly of components on printed wiring boards irrespective of their method of manufacture.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes BS 6221(1982) and BS 5370(1976) (07/2004) Supersedes 83/20739 DC and 86/32129 DC (09/2005)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
This standard has been withdrawn and is no longer current. No replacement edition is available.
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