BS 6221-22:1990
Withdrawn
Printed wiring boards Guide to the use of printed wiring board substrate materials: surface mount technology
Hardcopy , PDF
English
12-31-1990
03-01-2006
Committees responsible
Foreword
Guide
1. Scope
2. General
3. Introduction to base laminate materials
4. Material specifications
5. Phenolic resin based copper-clad laminates
6. Epoxide resin based copper-clad laminates
7. Polyimide resin based copper-clad laminates
8. Polyester resin based copper-clad laminates
9. Silicone resin based copper-clad laminates
10. Polytetrafluoroethylene (PTFE) resin based copper-
clad laminates
11. Compliant layer copper-clad laminates
12. Metallurgically bonded laminates
13. Ceramic base materials
14. Typical comparative material properties
Figures
1. Examples of a four multilayer board lay-up
2. Example of a six layer multilayer board lay-up
Tables
1. Comparative properties of phenolic resin and epoxide
resin based materials
2. Comparative properties of polyimide resin and
polyester resin based materials
3. Comparative properties of silicone resin and PTFE
resin based materials
4. Comparative properties of alumina, copper-clad invar,
copper-clad molybdenum and compliant layer materials
Guidance on the manufacture and properties of base laminate materials.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes BS 6221(1982) (07/2004) Supersedes 88/31464 DC (09/2005)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
This standard has been withdrawn and is no longer current. No replacement edition is available.
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