BS CECC 23200-801:1998
Withdrawn
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plated through holes
Hardcopy , PDF
English
06-15-1998
05-22-2026
National foreword
Foreword
1 General
2 Capability qualifying component
3 Capability approval
4 Capability test programme
5 Additional capability
6 Traceability
Annex A - Suitable test pattern for marking inks
Annex B - Suitable test pattern for solder masks
Annex C - Suitable test pattern for bonded heatsinks
Annex D - Edge connector imperfections
Annex E - CTP subdivision for thermal shock
Annex F - Circumferential defects in plated-through holes
Annex G - Determination of characteristic impedance by TDR
Pertains to rigid single and double-sided printed boards with plated-through holes, made with materials and surface finishes.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes BS EN 123200-800. To be read in conjunction with BS EN 123000 and BS EN 123200. (01/2006)
|
| DocumentType |
Standard
|
| Pages |
32
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
Withdrawn:This standard is no longer used
| Standards | Relationship |
| CECC 23200-801 : 1998 | Identical |
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