BS EN 165000-4:1996
Current
Film and hybrid integrated circuits Customer information, product assessment level schedules and blank detail specification
Hardcopy , PDF
English
10-15-1996
1 Introduction
1.1 How EN 165000 works
1.2 Customer/manufacturer interface
1.3 The product assessment level schedules
1.3.1 Derivation of the product assessment level
schedules
1.3.2 Indication of applications for the product
assessment level schedules
1.4 Test requirements of the PALS and their
applicability to real life application
1.4.1 The origin of the inspection requirements
1.4.2 Electrical tests
1.4.3 Other screening tests
1.4.4 Device sample testing
1.4.5 Design evaluation testing
1.4.6 AQLs, inspection levels and sampling plans
2 Product assessment level schedules and detail
specifications
PALS 1-11
3 Blank detail specification requirements
Front page for standard catalogue circuits
Front page for customer circuits
Section one - general data
Section two - inspection requirements
Example of a customer detail specification
Tables
1 PALS for solder or chip & wire (non-hermetic)
assembly
2 PALS for chip and wire (hermetic) assembly
| Committee |
EPL/47
|
| DevelopmentNote |
Reviewed and confirmed by BSI, Feb 2005. (02/2005) Supersedes 94/216401 DC. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
52
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| DIN EN 165000-4:1996-11 | Identical |
| NEN EN 165000-4 : 1996 | Identical |
| EN 165000-4:1996 | Identical |
| I.S. EN 165000-4:1998 | Identical |
| UNE-EN 165000-4:1996 | Equivalent |
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