BS EN 60068-2-30:1999
Superseded
View Superseded by
Environmental testing. Test methods Test Db and guidance: damp heat, cyclic (12 + 12 hour cycle)
Hardcopy , PDF
English
09-15-1999
11-09-2022
| Committee |
GEL/104
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
| Standards | Relationship |
| IEC 60749-25:2003 | Identical |
| EN 60068-2-30:1999 | Identical |
| I.S. EN 60068-2-30:1999 | Equivalent |
| EN 60068-2-30:1999 | Equivalent |
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