BS EN 60068-2-69:2017+A1:2019
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Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
09-11-2019
Publisher
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.
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