BS EN 60191-6-3:2001
Current
Current
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
05-15-2001
Publisher
US$244.16
Excluding Tax where applicable
Defines a method for quad flat packs (QFP) measuring dimensions classified into Form E.
| Committee |
EPL/47
|
| DevelopmentNote |
Also numbered as IEC 60191-6-3 (05/2001)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 60191-6-3:2001-06 | Identical |
| EN 60191-6-3:2000 | Identical |
| I.S. EN 60191-6-3:2001 | Identical |
| NF EN 60191-6-3 : 2001 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
Summarise
US$244.16
Excluding Tax where applicable
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