BS EN 60249-2-18:1993
Withdrawn
Specifications Specification No. 18. Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
Hardcopy , PDF
English
06-15-2001
10-01-2006
Committees responsible
National foreword
Foreword
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad sheet
7 Non-electrical properties of the base material
after complete removal of the copper foil
8 Packaging and marking
9 Acceptance testing
Annex ZA (normative) Other international publications
quoted in this standard with the references
of the relevant European publications
Table 1 - Electrical properties
Table 2 - Types, sizes and permitted number of
imperfections
Table 3 - Nominal thickness and tolerances of
metal-clad sheet
Table 4 - Maximum bow and twist
Table 5 - Deleted
Table 6 - Pull-off and peel strength
Table 7 - Deleted
Table 8 - Dimensional stability
Table 9 - Size tolerances for cut panels
Table 10 - Rectangularity of cut panels
Table 11 - Flexural strength
Table 12 - Flammability
Table 13 - Water absorption
Table 14 - Measling
Table 15 - Glass transition temperature and cure
factor
Table 16 - Thermal coefficient of expansion
Table 17 - Recommended acceptance tests
Requirements for properties in thicknesses of 0.5 mm to 6.4 mm.
| Committee |
EPL/501
|
| DevelopmentNote |
Also numbered as IEC 60249-2-18 Renumbers and supersedes BS 4584-102.18(1992). 1993 version incorporates amendment 8017 to BS 4584-102.18(1992). Supersedes 89/27824 DC and 98/232809 DC. (04/2005)
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| Standards | Relationship |
| I.S. EN 60249-2-18:1996 | Identical |
| EN 60249-2-18 : 1993 AMD 3 2000 | Identical |
| DIN EN 60249-2-18:2001-09 | Identical |
| IEC 60249-2-18:1992/AMD3:2000 | Identical |
| UNE-EN 60249-2-18:1997 | Identical |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| IEC 60249-3-1:1981 | Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards |
| EN 60249-1 : 1993 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |