BS EN 60249-2-4:1994
Withdrawn
Specifications Specification for epoxide woven glass fabric copper-clad laminated sheet, general purpose grade - Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade
Hardcopy , PDF
English
04-15-2001
10-01-2006
Committees responsible
National foreword
Foreword
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad sheet
6 Non-electrical properties of the base material after
complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) - Other international publications
quoted in this standard with the references of the
relevant European publications
In thicknesses of 0.5 mm up to 6.4 mm.
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS 4584-102.4(1990). 1994 version incorporates amendment 8244 to BS 4584-102.4(1990). Also numbered as IEC 60249-2-4 Supersedes BS 4584-2(1972), 89/22200 DC & 98/232800 DC. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| Standards | Relationship |
| DIN EN 60249-2-4:2000-12 | Identical |
| EN 60249-2-4 : 1994 AMD 5 2000 | Identical |
| I.S. EN 60249-2-4:1994 | Identical |
| IEC 60249-2-4:1987/AMD5:2000 | Identical |
| UNE-EN 60249-2-4:1996 | Identical |
| BS 123100-003:2001 | System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes |
| BS 123400-003:2001 | System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections |
| BS 123500-003:2001 | System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
| BS 123200-003:2001 | System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes |
| IEC 60249-3-1:1981 | Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards |
| EN 60249-1 : 1993 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
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