BS EN 60249-2-8:1995
Withdrawn
Withdrawn
Specifications Specification for flexible copper-clad polyester (PETP) film
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
02-01-1995
Publisher
Withdrawn date
10-01-2006
US$244.16
Excluding Tax where applicable
National foreword
Committees responsible
Specification
1. Scope
2. Materials and construction
3. Internal marking
4. Electrical properties
5. Non-electrical properties of the copper-clad film
6. Non-electrical properties of the base material
after complete removal of the copper foil
7. Packaging and marking
8. Acceptance testing
9. Additional requirements
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS 4584-102.8(1990). 1995 version incorporates amendment 8417 to BS 4584-102.8(1990). Also numbered as IEC 60249-2-8. Supersedes BS 4584-9(1977) & 89/22203 DC. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| Standards | Relationship |
| EN 60249-2-8 : 1994 COR 1994 | Identical |
| I.S. EN 60249-2-8:1995 | Identical |
| DIN EN 60249-2-8:1994-09 | Identical |
| UNE-EN 60249-2-8:1996 | Identical |
| BS 123400-003:2001 | System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections |
| BS 123700-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections |
| BS 123500-003:2001 | System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
| BS 123600-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections |
| BS EN 60249-1:1993 | Base materials for printed circuits Base materials for printed circuits. Test methods |
| BS 4584-103.2:1990 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials |
Summarise
US$244.16
Excluding Tax where applicable