BS EN 60317-35:2014+A1:2019
Withdrawn
Specifications for particular types of winding wires Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
Hardcopy , PDF
English
10-28-2019
08-08-2024
This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating.
| Committee |
W/-
|
| DocumentType |
Standard
|
| ISBN |
9780539018493
|
| Pages |
18
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
This part of IEC60317 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin.
NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics.
The range of nominal conductor diameters covered by this standard is:
Grade 1B: 0,020mm up to and including 0,800mm;
Grade 2B: 0,020mm up to and including 0,800mm.
The nominal conductor diameters are specified in Clause4 of IEC60317‑0‑1:2013.
| Standards | Relationship |
| IEC 60317-35:2013/AMD1:2019 | Identical |
| EN 60317-35:2014/A1:2019 | Identical |
| IEC 60317-35:2013+AMD1:2019 CSV | Identical |
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