BS EN 60464-2:2001

INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 General notes on methods of test
5 Methods of test for undried and/or uncured varnishes
   5.1 Flashpoint
   5.2 Density
   5.3 Viscosity
   5.4 Content of non-volatile matter
   5.5 Dilution ability
   5.6 Stability of varnish in an open vessel
   5.7 Drying and/or curing in thick layer
   5.8 Effect of varnish on enamelled winding wires
   5.9 pH of water or emulsion based varnish (Type W or Type E)
6 Methods of test for dried and/or cured varnishes
   6.1 Test specimen
   6.2 Mechanical properties
   6.3 Thermal properties
   6.4 Chemical properties
   6.5 Electrical properties
   6.6 Flash rusting of steel by water or emulsion based varnish
        (Type W or Type E)
   6.7 Volatile organic compound content of water or emulsion
        based varnish (Type W or Type E)
   6.8 Water content of water or emulsion based varnish (Type W
        or Type E)
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Describes methods of test to be used for testing varnishes used for electrical insulation.

IEC 62258-2:2011 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0. With respect to the first edition, several parameters have been updated for this edition.

This publication is to be read in conjunction with IEC 62258-1:2009.