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BS EN 61249-8-8:1997

Current

Current

Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

12-15-1997

US$204.12
Excluding Tax where applicable
Summarise this standard

Gives requirements for qualification of temporary solder resist coatings, known as masks as they are easily removable. Peelable solder masks are for screen printing to areas of a completed printed board or panel before shipment, so as to protect areas of the board or panel during processes by the board assembler. Mainly used for protection of keypad contacts during fluxing and mass soldering.

Committee
EPL/501
DevelopmentNote
Also numbered as IEC 61249-8-8 Supersedes 94/211487 DC (11/2005)
DocumentType
Standard
Pages
14
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
I.S. EN 61249-8-8:1999 Identical
DIN EN 61249-8-8:1998-01 Identical
EN 61249-8-8:1997 Identical
UNE-EN 61249-8-8:2000 Identical

US$204.12
Excluding Tax where applicable