Semiconductor devices. Micro-electromechanical devices Tensile testing method of thin film materials

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

11-30-2006

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Symbols and designations
4 Testing method and test apparatus
  4.1 Method of gripping
  4.2 Method of loading
  4.3 Speed of testing
  4.4 Force measurement
  4.5 Elongation measurement
  4.6 Stress-strain curve
  4.7 Environment control
5 Test piece
  5.1 General
  5.2 Plane shape of test piece
  5.3 Test piece thickness
  5.4 Gauge mark
6 Test report
Annex A (informative) Test piece grip methods
Annex B (normative) Testing conditions
Annex C (informative) Test piece
Annex ZA (normative) Normative references to international
                      publications with their corresponding
                      European publications

Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10[mu]m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.

Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.

Committee	EPL/47
DocumentType	Standard
Pages	16
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
EN 62047-2:2006	Identical
NF EN 62047-2 : 2006	Identical
NBN EN 62047-2 : 2007	Identical
IEC 62047-2:2006	Identical
DIN EN 62047-2:2007-02	Identical
I.S. EN 62047-2:2006	Identical

ISO 6892:1998

Metallic materials Tensile testing at ambient temperature

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BS EN 62047-2:2006

Semiconductor devices. Micro-electromechanical devices Tensile testing method of thin film materials

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory