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BS EN 62258-6:2006

BS EN 62258-6:2006

Current

Current

The latest, up-to-date edition.

Semiconductor die products Requirements for information concerning thermal simulation

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

11-30-2006

Publisher

British Standards Institution

INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information for thermal simulation
  5.1 Requirements for bare die with or without added
      connection structures
  5.2 Requirements for minimally-packaged die
  5.3 Information on thermal simulation model
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2

Committee
EPL/47
DevelopmentNote
Supersedes BS PD ES 59008-4.3 & 05/30139923 DC. (11/2006)
DocumentType
Standard
Pages
14
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
IEC 62258-6:2006 Identical
NBN EN 62258-6 : 2007 Identical
EN 62258-6 : 2006 Identical
DIN EN 62258-6:2007-02 Identical
I.S. EN 62258-6:2006 Identical
NF EN 62258-6 : 2006 Identical

EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats

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Hardcopy - English
PDF - English
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