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BS EN 62374-1:2010

BS EN 62374-1:2010

Current

Current

The latest, up-to-date edition.

Semiconductor devices Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

06-30-2011

Publisher

British Standards Institution

1 Scope
2 Terms and definitions
3 Test equipment
4 Test samples
5 Procedures
6 Lifetime estimation
7 Lifetime dependence on inter-metal layer area
8 Summary
Annex A (informative) - Engineering supplementation for
        lifetime estimation
Bibliography

Specifies a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

Committee
EPL/47
DevelopmentNote
Supersedes 07/30171395 DC. (12/2010) Earlier supersedes BS EN 62374 in error by publisher, now has been re-instated. (06/2011)
DocumentType
Standard
Pages
20
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
EN 62374-1:2010/AC:2011 Identical
IEC 62374-1:2010 Identical

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Hardcopy - English
PDF - English
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