BS IEC 63011-1:2018
Current
Integrated circuits. Three dimensional integrated circuits Terminology
Hardcopy , PDF
English
01-24-2019
| Committee |
EPL/47
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
IEC63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.
| Standards | Relationship |
| IEC 63011-1:2018 | Identical |
| IEC 61362:2012 | Identical |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.